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"WLSCP" references for the Electrical Engineer
Entries 1 through 1 of 1 were returned.
| Name |
Type |
Details
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| FlipChips DOT COM Tutorials
|
Web-Site |
Description: A fantastic collection of over five dozen tutorials on flip chip and micropackaging topics. AAA+
[show less...]
Author(s): Various
License: Commercial
Format: HTML
Price: free
URL: http://www.flipchips.com/
ReviewText: Here's a full list of the tutorials available as of the posting date of this topic:
- Introduction to Flip Chip
- Solder Bump Flip Chip
- Stud Bump Flip Chip
- Polymer Bump Flip Chip
- Anisotropic Conductive Film (ACF)Flip Chip
- A Brief History of Flipped Chips
- Electroless Nickel-Gold Flip Chip
- Reworking Underfilled Flip Chip
- Thermosonic Flip Chip Assembly
- Flip Chip Interconnection for Detector Arrays
- Under Bump Metallization (UBM)
- Solder Bumping Step by Step
- Bonding Edge Emitting Laser Diodes Using Gold/Tin Preforms
- Substrates for Flip Chip
- Packaging, Handling, and Storing of Solder Spheres
- SOC, SOP, and WLSCP
- Fluxing for Flip Chip
- Understanding Reliability Criteria for Solder Bumped Devices
- Causes of Misalignment
- Probing Bumped Flip Chips
- Controlling Stress in Thin Films
- Reworking Anisotropic Conductive Film (ACF) Flip Chip Assemblies
- Gold Stud Bump Applications
- Low Temperature Flip Chip for Flexible Displays
- The Coming of Copper UBM
- Shaping Gold Ball Bumps
- Copper Bumps for Flip Chip Assembly
- Micro-Posts: Tall, Slender, Stud Bumps
- Measuring thin films by spectral reflectance, Part 1
- Wafer level hermetic cavity chip scale packages for RF
- Gold Stud Bumping - the Other Flip-Chip Process
- Conductive Polymer Assembly of High Pin Count Flip Chip
- Sputtered nickel UBM for lead-free solder bumping
- Measuring thin films by spectral reflectance, Part 2
- MEMS Special Packaging Needs
- Too much gold can be a bad thing
- Evaporated Indium Bumps for Flip Chip
- Electromigration and Thermomigration in Flip Chip Solder Joints
- Nano-embossing reaches production
- Hermeticity: much to do about nothing
- Evaluating Wafer Level Solder Reflow Options to Maximize Yield
- Wafer-level Hermetic Cavity Packaging
- Advanced Wafer-level Cleaning Method
- Lead-Free Facts and Myths
- Alloy Electroplating: The best solution for Au-Sn solder?
- Flip Chip Bonder for Assembling 3D MEMS
- Drop-in Lead-free solder
- Wafer-level Nano-optics
- Gold Stud Bump Update
- Solder Bumping Single Die
- New Generation Nano-Imprint Lithography System
- Probe testing differences in lead-free bumps
- Nano Particle Adhesives
- The Promise of C4NP
- Injection Molding Solder Bumps
- Thermosonic Bonding of 1,000-bump Flip Chips
- Nanosoldering electronic components at room temperature
- Lower temperature lead-free flip chip
- Nanotube Heat Sinks
- Lead-Free Solder Bumping Methods
- Vapor Jet Deposition of Multi-Metal Films
- C4NP Test Data
- Silver Nano-platelet Precursors for Ultra-Thin Conductors
- Cleaning microelectronic devices by Vacuum Cavitational Streaming
- Underfilling Processes
Keywords: SoC
, MEMS
, nanotechnology
, flip chip
, solder bump
, stud bump
, ball bumps
, solder sphere
, SoP
, WLSCP
, thin films
, solder reflow
, lead-free
, injection molding
Submitter: EE HomePage Editorial Staff
Affiliation: None
xml_ID: 1159634003 ( single entry page)
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