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Author(s): Various
License: Commercial
Format: HTML
Price: free
URL: http://www.flipchips.com/
ReviewText: Here's a full list of the tutorials available as of the posting date of this topic:

• Introduction to Flip Chip
• Solder Bump Flip Chip
• Stud Bump Flip Chip
• Polymer Bump Flip Chip
• Anisotropic Conductive Film (ACF)Flip Chip
• A Brief History of Flipped Chips
• Electroless Nickel-Gold Flip Chip
• Reworking Underfilled Flip Chip
• Thermosonic Flip Chip Assembly
• Flip Chip Interconnection for Detector Arrays
• Under Bump Metallization (UBM)
• Solder Bumping Step by Step
• Bonding Edge Emitting Laser Diodes Using Gold/Tin Preforms
• Substrates for Flip Chip
• Packaging, Handling, and Storing of Solder Spheres
• SOC, SOP, and WLSCP
• Fluxing for Flip Chip
• Understanding Reliability Criteria for Solder Bumped Devices
• Causes of Misalignment
• Probing Bumped Flip Chips
• Controlling Stress in Thin Films
• Reworking Anisotropic Conductive Film (ACF) Flip Chip Assemblies
• Gold Stud Bump Applications
• Low Temperature Flip Chip for Flexible Displays
• The Coming of Copper UBM
• Shaping Gold Ball Bumps
• Copper Bumps for Flip Chip Assembly
• Micro-Posts: Tall, Slender, Stud Bumps
• Measuring thin films by spectral reflectance, Part 1
• Wafer level hermetic cavity chip scale packages for RF
• Gold Stud Bumping - the Other Flip-Chip Process
• Conductive Polymer Assembly of High Pin Count Flip Chip
• Sputtered nickel UBM for lead-free solder bumping
• Measuring thin films by spectral reflectance, Part 2
• MEMS Special Packaging Needs
• Too much gold can be a bad thing
• Evaporated Indium Bumps for Flip Chip
• Electromigration and Thermomigration in Flip Chip Solder Joints
• Nano-embossing reaches production
• Hermeticity: much to do about nothing
• Evaluating Wafer Level Solder Reflow Options to Maximize Yield
• Wafer-level Hermetic Cavity Packaging
• Advanced Wafer-level Cleaning Method
• Lead-Free Facts and Myths
• Alloy Electroplating: The best solution for Au-Sn solder?
• Flip Chip Bonder for Assembling 3D MEMS
• Drop-in Lead-free solder
• Wafer-level Nano-optics
• Gold Stud Bump Update
• Solder Bumping Single Die
• New Generation Nano-Imprint Lithography System
• Probe testing differences in lead-free bumps
• Nano Particle Adhesives
• The Promise of C4NP
• Injection Molding Solder Bumps
• Thermosonic Bonding of 1,000-bump Flip Chips
• Nanosoldering electronic components at room temperature
• Lower temperature lead-free flip chip
• Nanotube Heat Sinks
• Lead-Free Solder Bumping Methods
• Vapor Jet Deposition of Multi-Metal Films
• C4NP Test Data
• Silver Nano-platelet Precursors for Ultra-Thin Conductors
• Cleaning microelectronic devices by Vacuum Cavitational Streaming
• Underfilling Processes

Keywords: SoC , MEMS , nanotechnology , flip chip , solder bump , stud bump , ball bumps , solder sphere , SoP , WLSCP , thin films , solder reflow , lead-free , injection molding
Submitter: EE HomePage Editorial Staff
Affiliation: None
xml_ID: 1159634003 (single entry page)

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Author(s): Various
License: Commercial
Format: HTML
Price: Free
URL: http://www.memsinvestorjournal.com/
ReviewText: Basically, a BLOG on the subject of MEMS, with interviews of various industry leaders.
Keywords: RF , MEMS , nanotechnology , Fabrication Equipment
Submitter: EE HomePage Editorial Staff
Affiliation: None
xml_ID: 1174023075 (single entry page)

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Author(s): MEMS and Nanotechnology Clearinghouse
License: Some Restrictions (includes GNU)
Format: HTML
Price: free
URL: http://www.memsnet.org/ mems/ processes/
ReviewText: HTML-based tutorial hosted by the MEMS and Nanotechnology Clearinghouse. The tutorial covers:

• Deposition processes
• Lithography
• Etching processes

The tutorial appears to be well written and illustrated. Someone familiar with semiconductor processes can probably get through it in an hour or so.
Keywords: deposition , lithography , MEMS , chemical vapor deposition , epitaxy , sputtering , etching , nanotechnology
Submitter: EE HomePage Editorial Staff
Affiliation: None
xml_ID: 1149476175 (single entry page)

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Author(s): Various
License: Commercial
Format: PDF
Price: Free online
URL: http://www.sma-digital.com
ReviewText: Available as a PDF download or as a unique Ezine online.
Keywords: MEMS , nanotechnology , photonics
Submitter: EE HomePage Editorial Staff
Affiliation: None
xml_ID: 1168924332 (single entry page)

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Author(s): Various
License: Unknown
Format: Paper, Video
Price: Free
URL: http://www.techbriefs.com/
Keywords: nanotechnology , photonics , motor control , technology transfer , defense
Submitter: EE HomePage Editorial Staff
Affiliation: None
xml_ID: 1177208147 (single entry page)

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Author(s): Various
License: Unknown
Format: Paper, Video
Price: Free
URL: http://www.defensetechbriefs.com/
ReviewText: Topics include:

• Electronics & Computers
• Photonics
• Software
• Materials
• Mechanics & Machinery
• Manufacturing & Prototyping
• Bio-Medical
• Physical Sciences
• Information Sciences

Keywords: nanotechnology , materials , computers , photonics , motor control , technology transfer , defense , software , bio-medical
Submitter: EE HomePage Editorial Staff
Affiliation: None
xml_ID: 1177208483 (single entry page)

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Author(s): Drexler, Eric & Peterson, Chris & Pergamit, Gayle
License: Commercial
Format: PDF
Price: Free
URL: http://www.foresight.org/ UTF/ download/ unbound.pdf
ReviewText: Steward Brand, in the book's forward, states: "This book delivers a rich array of micro-scenarios of nanotechnology at work, some thrilling, some terrifying, all compelling. Probably none represent exactly what will happen, but in aggregate they give a deep sense of the kind of thing that will happen. Strategies of how to stay ahead of the process are proposed, but the ultimate responsibility for the wholesome use and development of nanotechnology falls on every person aware of it."
Keywords: nanotechnology , futurist , molecular assembly
Submitter: EE HomePage Editorial Staff
Affiliation: None
xml_ID: 1175383061 (single entry page)

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Author(s): Keithley
License: Commercial
Format: Paper
Price: Free
URL: http://www.keithley.com/ wb/ 201
Limitations: We couldn't find an online copy, but Keithly will send you a free bound copy simply by filling out the form at the link we've supplied. We got our copy a few weeks after registering.
ReviewText: Topics include:

• Electrical Measurements on Nanoscale Materials
• Recognizing the Sources of Measurement Errors
• Examples of Low Current Measurements on Nanoelectronic and Molecular Electronic Devices
• Characterizing Nanoscale Devices with Differential Conductance Measurements
• Electronic Transport Characteristics of Gallium Nitride Nanowire-based Nanocircuits
• Nanodevice Measurement Techniques

Keywords: MEMS , nanotechnology , lab measurements , Keithley
Submitter: EE HomePage Editorial Staff
Affiliation: None
xml_ID: 1188482397 (single entry page)

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Author(s): Keithley
License: Commercial
Format: Paper
Price: Free
URL: http://www.keithley.com/ wb/ 201
Limitations: We couldn't find an online copy, but Keithly will send you a free bound copy simply by filling out the form at the link we've supplied. We got our copy a few weeks after registering.
ReviewText: Topics include:

• Integrating high frequency capacitance measurements for monitoring process variation
• Qualifying high K gate materials with charge-trapping measurements
• How to get accurate trap density measurements using charge pumping
• RF wafer testing
• Statistical process control of wireless device manufacturing
• Wafer reliability testing
• Femtoamp DC Leakage for Mobile ICs

Keywords: wireless , RF , MEMS , nanotechnology , semiconductors , lab measurements , Keithley , reliability testing , thermal stability , BiCMOS , statistical process control
Submitter: EE HomePage Editorial Staff
Affiliation: None
xml_ID: 1188483176 (single entry page)

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Dues: free
URL: http://www.nnin.org/
Limitations: Supported by the National Science Foundation
ReviewText: Includes streaming multimedia presentations on demand. Their education portal provides educational resources for all age and education levels.
Keywords: nanotechnology , NNIN , career
Submitter: EE HomePage Editorial Staff
Affiliation: Use services, but not a member
xml_ID: 1147572418 (single entry page)