| Name | Type | Details |
| Designing With Plastics: A Practical Guide for Engineers | Web-Site |
Description: Design News magazine brought together tutorials and tools to assist engineers designing with plastics.
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Author(s): Design News License: Commercial Format: Video Price: Free URL: http://www.designnews.com/ info/ CA6316965.html ReviewText: Electronics don't exist in a vacuum, which is why EE HomePage.com includes materials on other topics. You may find this particular website useful when you suddenly need to become knowledgeable regarding product packaging options. Topics covered on this site include:
Keywords: packaging , mechanical engineering , plastic , molding , polymers Submitter: EE HomePage Editorial Staff Affiliation: None xml_ID: 1177293366 (single entry page) |
| International Technology Roadmap for Semiconductors | Specification |
Description: "The International Technology Roadmap for Semiconductors, known throughout the world as the ITRS, is the fifteen-year assessment of the semiconductor industry's future technology requirements."
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Author(s): Consortium License: Commercial Format: PDF Price: free online URL: http://www.itrs.net/ ReviewText: This is the site to go to if you want to consult the best crystal ball that the semiconductor business has to offer. We're not sure how we missed listing it in the EE HomePage.com databases before now. The reports are quite detailed. If you are in the business, you need to check this one out. Keywords: semiconductor , manufacturing , wireless , simulation , lithography , packaging , interconnect , roadmap , ITRS , ESIA , JEITA , KSIA , TSIA , SIA , DRAM , flash memory , gate length , modeling , process integration , yield enhancement , metrology Submitter: EE HomePage Editorial Staff Affiliation: None xml_ID: 1169950339 (single entry page) |
| Basics of Design | Tutorial |
Description: Electronic Design magazine occasionally includes a glossy insert entitled: "basics of Design". Each is corporate sponsored, and provides a basic tuturial on some design task. The collection is available at this location on the Electronic Design web site.
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Author(s): Various Corporate License: Commercial Format: Paper, HTML, PDF Price: free URL: http://www.elecdesign.com/ Departments/ Index.cfm? AD=1& amp;DepartmentID=24 Limitations: These are short, basic, tutorials. You won't be an expert after reading one. But it may be enough to wet your appetite to learn more about a subject. These ARE vendor-sponsored, so don't be surprised to see that month's sponsor listed somewhere in the article. ReviewText: At the time of this entry, topics include:
Keywords: EDA , ADC , DAC , wireless , filters , SoC , RF , FPGA , microprocessor , tutorials , Op Amps , packaging , DC-DC conversion , ASICs , power systems , programmable logic , power management , LVDS , IEEE 802.3af , VoIP , lab measurement Submitter: EE HomePage Editorial Staff Affiliation: Reader xml_ID: 1151970790 (single entry page) |
| Introduction to Integrated Circuit Technology | Tutorial |
Description: This 21 page introduction to IC fabrication technology is offered by IC Knowledge LLC.
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Author(s): Jones, Scotten W. License: Commercial Format: PDF Price: Free URL: http://www.icknowledge.com/ misc_technology/ IntroToICTechRev4.pdf ReviewText: Topics include:
Keywords: etching , packaging , fabrication , oxidation , photolithography , ion implantation , vapor deposition , sputter deposition Submitter: EE HomePage Editorial Staff Affiliation: None xml_ID: 1168135800 (single entry page) |
| Circuits Assembly : The Journal of Surface Mount and Electronics Assembly | Magazine/Journal |
Description: Monthly magazine dealing with electronic assembly topics.
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Author(s): Various License: Commercial Format: Paper, PDF, Video Price: Free URL: http://circuitsassembly.com/ cms/ Limitations: You have to register (free) to access all content on the Circuits Assembly website. Keywords: packaging , SMD , surface mount technology Submitter: EE HomePage Editorial Staff Affiliation: None xml_ID: 1177903198 (single entry page) |
| Study and characterization of plastic encapsulated packages for MEMS | Thesis |
Description: 167 page master's thesis submitted to Worcester Polytechnic Institute.
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Author(s): Deshpande, Anjali W. License: Other Format: PDF Price: Free URL: http://www.wpi.edu/ Pubs/ ETD/ Available/ etd-01145-144711/ unrestricted/ thesis-final.pdf Keywords: MEMS , packaging , die attach Submitter: EE HomePage Editorial Staff Affiliation: None xml_ID: 1169092858 (single entry page) |
| A (not so) short introduction to MEMS | Book |
Description: "A one chapter description of MEMS technology that can be used by beginers or as course document for introductory MEMS class."
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Author(s): Chollet, Franck & Liu, Haobing License: Some Restrictions (includes GNU) Format: PDF Price: Free URL: http://memscyclopedia.org/ Document/ introMEMS.pdf Limitations: "Free to use, reuse or modify, but copyright is retained by the original authors and their use need to be acknowledged. Moreover the documents can not be used commercially without the copyright owner consent." ReviewText: 135 pages. Covers MEMS fabrication, system partitioning, structures, packaging, assembly and test. Keywords: sensors , Actuators , MEMS , packaging , capacitive sensing , DRIE , micromachining , piezoresistive sensing Submitter: EE HomePage Editorial Staff Affiliation: None xml_ID: 1277579024 (single entry page) |
| Name | Type | Details |
| InCyte Lite | Chip Estimation |
Description: ChipEstimate.com offers a free version of their InCyte chip estimation tool. Their website states "The system is used by thousands of chip planners to assess project feasibility, compare different IP configurations and to see the impact of new process nodes and IP on new and existing designs. Users input a high level design specification and InCyte Lite produces industry average estimations of chip die size, power, and leakage. Models used for estimation are built based upon averages from leading foundries and IP library suppliers. InCyte provides industry average estimation of the following key metrics:
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License: Commercial Price: Free URL: http://www.chipestimate.com/ incytelite.html OSs: Windows Limitations: In addition to InCyte Lite, there are two other versions of the tool available for purchase. Page 2 of the InCyte Datasheet has a chart comparing the features. Keywords: packaging , yield , leakage , SoC design , die size , power consumption , die cost , estimation Submitter: EE HomePage Editorial Staff Affiliation: User xml_ID: 1198716222 (single entry page) |
| Name | Type | Details |
| MFG.com - "The Global Manufacturing Marketplace" | Other |
Description: Did you ever wonder how small to medium size companies hook up with outsource suppliers overseas? Who finds who? Who initiates the business relationship? Well, it turns out that there are middlemen to do just that. MFG.com is funded by suppliers on a subscription basis, and free to buyers who need to find a supplier.
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Dues: See website URL: http://mfg.com Limitations: Although intrigued by their business model, we have no first hand knowledge of MFG.com. As with any other organization listed in our databases, please exercise proper due diligence prior to entering into any business relationship with this or any other company. ReviewText: We've not used MFG.com's services, but we were able to create a user account in seconds and poke around their site a bit. We discovered them via an article in the May 2007 issue of Design World Magazine. Keywords: packaging , prototyping , fabrication , machining , Outsourcing , suppliers , assembly , engineering services Submitter: EE HomePage Editorial Staff Affiliation: None xml_ID: 1180322914 (single entry page) |
| International Microelectronics And Packaging Society | Professional |
Description: "The International Microelectronics And Packaging Society (IMAPS)
is the largest society dedicated to the advancement and growth of microelectronics
and electronics packaging technologies through professional education.
The Society's portfolio of technologies is disseminated through symposia,
conferences, workshops, professional development courses and other efforts.
IMAPS currently has more than 4,000 members in the United States and more
than 4,000 international members around the world."
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Dues: $75 Individual/Year. See web site for options. URL: http://www.imaps.org/ Keywords: sensors , fuel cells , MEMS , packaging , electronics packaging , SMD , IMAPS , ceramic packaging , LTCC , wirebond , flipchip , SIP Submitter: EE HomePage Editorial Staff Affiliation: None xml_ID: 1174179533 (single entry page) |