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"packaging" references for the Electrical Engineer
Entries 1 through 7 of 7 were returned.
Name Type Details
Designing With Plastics: A Practical Guide for Engineers Web-Site Description: Design News magazine brought together tutorials and tools to assist engineers designing with plastics.
International Technology Roadmap for Semiconductors Specification Description: "The International Technology Roadmap for Semiconductors, known throughout the world as the ITRS, is the fifteen-year assessment of the semiconductor industry's future technology requirements."
Basics of Design Tutorial Description: Electronic Design magazine occasionally includes a glossy insert entitled: "basics of Design". Each is corporate sponsored, and provides a basic tuturial on some design task. The collection is available at this location on the Electronic Design web site.
Introduction to Integrated Circuit Technology Tutorial Description: This 21 page introduction to IC fabrication technology is offered by IC Knowledge LLC.
Circuits Assembly : The Journal of Surface Mount and Electronics Assembly Magazine/Journal Description: Monthly magazine dealing with electronic assembly topics.
Study and characterization of plastic encapsulated packages for MEMS Thesis Description: 167 page master's thesis submitted to Worcester Polytechnic Institute.
A (not so) short introduction to MEMS Book Description: "A one chapter description of MEMS technology that can be used by beginers or as course document for introductory MEMS class."

"packaging" related tools for the Electrical Engineer
Entries 1 through 1 of 1 were returned.
Name Type Details
InCyte Lite Chip Estimation Description: ChipEstimate.com offers a free version of their InCyte chip estimation tool. Their website states "The system is used by thousands of chip planners to assess project feasibility, compare different IP configurations and to see the impact of new process nodes and IP on new and existing designs. Users input a high level design specification and InCyte Lite produces industry average estimations of chip die size, power, and leakage. Models used for estimation are built based upon averages from leading foundries and IP library suppliers. InCyte provides industry average estimation of the following key metrics:
  • Die area - Total die size and bounding, factoring in all specified IP and design components.
  • Power - Dynamic power consumption computed based on individual design components, factoring in frequency, switching activities, gate and IP data.
  • Leakage - Static power consumption computed and broken down by core, I/O, hierarchical block, as well as each IP macro. "

"packaging" related organizations for the Electrical Engineer
Entries 1 through 2 of 2 were returned.
Name Type Details
MFG.com - "The Global Manufacturing Marketplace" Other Description: Did you ever wonder how small to medium size companies hook up with outsource suppliers overseas? Who finds who? Who initiates the business relationship? Well, it turns out that there are middlemen to do just that. MFG.com is funded by suppliers on a subscription basis, and free to buyers who need to find a supplier.
International Microelectronics And Packaging Society Professional Description: "The International Microelectronics And Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education. The Society's portfolio of technologies is disseminated through symposia, conferences, workshops, professional development courses and other efforts. IMAPS currently has more than 4,000 members in the United States and more than 4,000 international members around the world."