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EE HomePage.com Subject Survey

System-on-Package

EE HomePage subject surveys bring together references on specific subjects that might not individually make it into the EEHP databases. This particular survey is on the subject of System-On-Package.

  1. Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection, IBM Journal of Research and Development
  2. Moore's Law Meets Its Match
  3. Text: Introduction to System-On-Package (SOP), by Rao Tummala, $125, Mcgraw-Hill Professional
  4. Compact System-On-Package (SOP) Architectures for lwo cost RF Front-end modules.
  5. 3D Integration: A Revolutionary Approach for SOP Millimeter-Wave Functions for High Data Rate Wireless Systems using Ceramic and Organic Technologies
  6. The Surface Mount Technology Association
  7. RF System in Package: Considerations, Technologies and Solutions
  8. Facilitating System-in-Package (SiP) design
  9. Amkor System in Package technology overview
  10. System-In-Package Technology, Application and Trends
  11. System in Package versus System on Chip
  12. IC Packages Feel The SQUEEZE
  13. SiP, 3-D IC stacking combat ever-shrinking form factors