EE HomePage.com Subject Survey
System-on-Package
EE HomePage subject surveys bring together references on specific subjects that might not individually make it into the EEHP databases. This particular survey is on the subject of System-On-Package.
- Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection, IBM Journal of Research and Development
- Moore's Law Meets Its Match
- Text: Introduction to System-On-Package (SOP), by Rao Tummala, $125, Mcgraw-Hill Professional
- Compact System-On-Package (SOP) Architectures for lwo cost RF Front-end modules.
- 3D Integration: A Revolutionary Approach for SOP Millimeter-Wave Functions for High Data Rate Wireless Systems using Ceramic and Organic Technologies
- The Surface Mount Technology Association
- RF System in Package: Considerations, Technologies and Solutions
- Facilitating System-in-Package (SiP) design
- Amkor System in Package technology overview
- System-In-Package Technology, Application and Trends
- System in Package versus System on Chip
- IC Packages Feel The SQUEEZE
- SiP, 3-D IC stacking combat ever-shrinking form factors